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DIE ATTACH ADHESIVE FOR HIGH THERMAL BGA |
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Hybrid |
8,000 |
4.5 |
1.5 |
1700 |
L3 L2/
260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
High thermal conductivity, low bleed
on Ag.
High adhesion on variety of
substrates. |
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Thermo-
plastic/
thermoset |
11,500 |
6.0 |
8.0 |
6460 |
L3/260ºC
RF SiP |
30 min ramp 175ºC
+ 15 min @ 175ºC |
High thermal and electrical
conductivity.
Excellent bleed
performance on Ag. |
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DIE ATTACH ADHESIVE FOR SMART CARD APPLICATIONS |
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Hybrid |
11,600 |
4.6 |
2.3 |
3300 |
N/A |
90 seconds
@ 110ºC |
Low stress, low temperature fast
cure.
Low modulus. |
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Hybrid |
10,500 |
4.5 |
0.3 |
2500 |
N/A |
90 seconds
@ 110ºC |
Non-conductive. Low stress,
low temperature
fast cure. |
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DIE ATTACH ADHESIVE AND LENS ATTACH FOR IMAGE SENSOR PACKAGING |
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Hybrid |
11,600 |
4.6 |
2.3 |
3300 |
N/A |
90 seconds
@ 110ºC |
Low stress, low temperature fast
cure.
Low modulus. |
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Hybrid |
10,500 |
4.5 |
0.3 |
2500 |
N/A |
90 seconds
@ 110ºC |
Non-conductive. Low stress, low
temperature
fast cure. |
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Acrylate |
10,000 |
5.4 |
N/A |
70 |
N/A |
15 minutes
@ 175ºC |
Electrically insulating, ultra low
modulus.
Better dispensability. |
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Epoxy |
9,500 |
5.6 |
N/A |
1400 |
N/A |
2 minutes
@ 150ºC |
Nonconductive, black pigmentation.
Low
temperature cure.Good
adhesion
to LCP, PA, PBT. |
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Epoxy |
22,000 |
5.4 |
N/A |
3540 |
N/A |
60 minutes
@ 80ºC |
Nonconductive, black pigmentation.
Low temperature cure. |
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Hybrid |
20,000 |
3.6 |
N/A |
2100 |
N/A |
10 second UV cure |
Nonconductive photocurable
adhesive.
For glass lid seal. |
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