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DIE ATTACH ADHESIVES FOR LAMINATE-BASED BGA |
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Hybrid |
11,500 |
5.0 |
0.4 |
160 |
L2/60ºC
BGA |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Non-conductive.
High cohesive
strength, low stress, low moisture
absorption.
Provides thin bondline. |
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Hybrid |
11,500 |
5.0 |
0.4 |
260 |
L3/260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Non-conductive. Improved work life
version
of ABLEBOND 2025D. |
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Hybrid |
9,000 |
5.3 |
1.2 |
1500 |
L3/L2
260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Ultra-low moisture absorption, high
hot/wet adhesion, low stress. 260ºC
IR
reflow capability. |
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Hybrid |
9,000 |
5.9 |
0.6 |
1800 |
L3/L2
260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Ultra-low moisture absorption, high
hot/wet adhesion, low stress. |
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DIE ATTACH ADHESIVES FOR POLYIMIDE-BASED BGA |
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Hybrid |
11,500 |
5.0 |
0.4 |
260 |
L3/260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Non-conductive. Improved work
life version
of ABLEBOND 2025D. |
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DIE ATTACH ADHESIVE FOR CHIP STACKING BGA |
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Hybrid |
13,000 |
5.0 |
0.4 |
160 |
L2/260ºC
BGA |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Non-conductive. High cohesive
strength, low stress, low moisture
absorption.
Provides thin bondline. |
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Hybrid |
13,000 |
2.5 |
N/A |
90 |
L3/260ºC
BGA |
30 min ramp 175ºC
+ 15 min @ 175ºC |
For die stacking applications.
Low stress. |
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DIE ATTACH ADHESIVE FOR THERMALLY ENHANCED BGA |
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Epoxy |
9,500 |
5.6 |
0.6 |
2900 |
L3/260ºC |
30 min ramp 175ºC
+ 15 min @ 175ºC |
Improved JEDEC performance,
low stress, and excellent adhesion
to Cu. Suitable for various package
sizes. |
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