Ablestik is the world’s leading manufacturer of adhesives and specialty materials for semiconductor packaging and microassembly applications. Headquartered in Rancho Dominguez, California the company operates five manufacturing sites in:

• Rancho Dominguez, California
• Cambridge, England
• Atsugi, Japan
• Seoul, Korea
• Shanghai, China

Additional technical sales offices are located in Germany, Italy, Hong Kong, Malaysia, Philippines, Singapore, Taiwan and Thailand.

Ablestik’s global state-of-the-art research and development facilities are continuously working to bring you the latest technical innovations in semiconductor packaging materials. Our R&D capabilities combined with extensive sales and technical support make Ablestik the obvious choice for your next generation packaging requirements.

Semiconductor Packaging Materials
Ablestik offers a complete line of adhesives for semiconductor packaging applications.

Our paste adhesive line contains electrically conductive, nonconductive, thermal cure, and light cure materials.

Ablestik adhesive films are available in electrically conductive, nonconductive, thermal cure, and thermoplastic versions.

Our resin encapsulant line include capillary underfills, wafer level underfills and no flow underfills.

Diverse core technologies enable product versatility for ever-changing customer requirements.

Our technology portfolio contains over 100 patents and includes hybrid die attach technology, acrylate resin technology, modified silicone technology, moisture resistant cyanate ester (MRCE) technology, dual cure hybrid chemistry and adhesive conductivity promoters. Over 90% of our new products are patent protected.

This combination of proven chemistry and new proprietary resin technology delivers hybrid chemistries with improved performance in: